1. The influence of base polymers
Base polymers are an important part of the chemical composition of LDS Laser Forming Materials. Common base polymers include polycarbonate (PC), polyamide (PA), etc. Taking polycarbonate as an example, it provides good mechanical properties for the material, so that the molded product has high strength and toughness. This is because the molecular chain of polycarbonate contains a rigid benzene ring structure, which can withstand large external forces and is not easy to deform. This characteristic makes LDS materials based on polycarbonate have obvious advantages in manufacturing products with high structural strength requirements such as electronic equipment housings.
When polyamide is used as a base polymer, due to the presence of a large number of amide bonds in its molecular chain, the material has good wear resistance. This is because the hydrogen bonding between amide bonds enhances the bonding force between molecular chains and can effectively resist wear during friction. In addition, polyamide also has a certain hygroscopicity. Although this characteristic may have an adverse effect on material performance in some cases, in some special applications, such as when the conductivity of the material needs to be adjusted, it can be achieved by controlling hygroscopicity.
2. The role of metal fillers
Metal fillers are the key factors affecting the performance of LDS Laser Forming Materials. The addition of metal fillers such as copper and silver greatly improves the conductivity of the material. When the laser irradiates the material, the metal filler forms a conductive circuit on the surface of the material. Copper fillers have good conductivity and relatively low cost, and are widely used in application scenarios where the conductivity requirements are not extremely high. Silver fillers have better conductivity, but the cost is higher, and are often used in high-end products with strict requirements on conductivity.
The content and particle size of metal fillers also have an important influence on the performance of the material. Properly increasing the content of metal fillers can improve the conductivity of the material, but too much filler may cause the processing performance of the material to deteriorate, such as reduced fluidity, making molding difficult. Smaller metal filler particle size helps to disperse evenly in the material, improve the overall performance of the material, and avoid local performance differences caused by filler agglomeration, thereby ensuring the quality and stability of the conductive circuit after laser forming.
3. Contribution of additives
Additives also play an indispensable role in LDS Laser Forming Materials. For example, some photoinitiators are added to enhance the sensitivity of the material to lasers. When irradiated by laser, photoinitiators can trigger chemical reactions on the surface of the material, promote the aggregation of metal fillers on the surface and the formation of circuits. At the same time, additives such as antioxidants can improve the stability of materials, prevent performance degradation due to oxidation during processing and use, extend the service life of materials, and ensure the reliability of products during long-term use.
