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Low Temperature PCABS

Low Temperature PCABS
Minimum order quantity: MOQ3000KG, special customized orders can be negotiated.
Production cycle: 3~4 weeks. Quality period: 3~5 years. Not brittle and does not require refrigeration.

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Features Technical Indicators Overall Dimension

PC/ABS alloy with excellent low temperature resistance and balanced physical properties is mainly used in auto parts and injection molding.

Physical properties	Typical data	unit	method
specific gravity	1.16	g/cm³-	ASTM D 792
Shrinkage, Flow Direction 1/8in (3.2mm)	0.4-0.7	%	ASTM D 955
Shrinkage, vertical flow direction 1/8in (3.2mm)	0.4-0.7	%	ASTM D 955
Melt Index, 260°C/5kg	15	g/10min	ASTM D 1238
Mechanical properties	Typical data	unit	method
Tensile yield strength, 50mm/min	54	MPa	ASTM D 638
Elongation at break, 50mm/min	55	%	ASTM D 638
Flexural strength, 2.6mm/min, 50mm span	75	MPa	ASTM D 790
Flexural modulus, 2.6mm/min, 50mm span	2300	MPa	ASTM D 790
Cantilever impact strength, 1/8in (3.2mm), notched, 23°C	500	J/m	ASTM D 256
Cantilever impact strength, 1/8in (3.2mm), notched, -40°C	250	J/m	ASTM D 256
Thermal performance	Typical data	unit	method
Heat deflection temperature, 264psi (1.8Mpa), 3.2mm	105	℃	ASTM D 648
Flame retardant properties	Typical data	unit	method
1.5	HB		UL 94

Processing conditions	unit	numeric value
Drying temperature	℃	90-100
Drying time	hrs	2
Maximum moisture content	%	0.02
Melt temperature	℃	240-270
Mouthpiece	℃	240-270
Anterior paragraph	℃	240-270
Middle	℃	240-270
Rear segment	℃	230-260
Mold temperature	℃	40-80
Back pressure	MPa	3-7
Screw speed	rpm	40-60

Statement:
The above data is strictly tested in the laboratory of Trivos Company in accordance with ASTM standards, and these typical performance data are for general information and reference only. These figures are approximate and not part of the product specifications. We try to give the most accurate data, but we do not guarantee it. The user shall carry out the necessary tests and analyses to determine for himself that the final product is safe and qualified under the conditions under which it will be used.