What are the specific requirements for the performance of LDS laser forming materials?
Publish Time: 2024-08-21
The performance requirements of LDS laser forming materials usually include the following aspects:
Laser induced performance:
High sensitivity: It is highly sensitive to lasers of specific wavelengths and can react quickly and efficiently under laser irradiation, so that components such as organic metal complexes can quickly release metal particles or produce other physical and chemical changes that are beneficial to subsequent processing.
Precise activation area control: After laser irradiation, the activation area on the surface of the material should have clear boundaries and precise dimensions, and be highly consistent with the designed circuit pattern to ensure that the formed circuit line is accurate and correct.
Mechanical properties:
Strength and toughness: It has sufficient strength, including tensile strength, bending strength, etc., and can withstand certain mechanical stresses, such as handling, assembly, and external forces that may be received during use during processing, to prevent the material from cracking, breaking or deforming. At the same time, it must also have good toughness to absorb impact energy and avoid damage due to accidental impact.
Wear resistance: It has a certain wear resistance, which can reduce the surface wear caused by friction during processing (such as drilling, cutting, grinding, etc.) and use, and ensure the surface quality and dimensional stability of the material. It is particularly important for some application scenarios that require frequent plugging and unplugging or contact with other components.
Dimensional stability: Under different temperature and humidity conditions and during processing, the dimensional change of the material should be as small as possible. For example, the thermal expansion coefficient should be low to ensure that when the temperature changes, the accuracy of the circuit pattern and the matching accuracy with other components will not be affected by excessive dimensional changes.
Thermal properties:
Thermal stability: It has a high heat deformation temperature and can maintain the stability of its shape and performance under a certain high temperature environment (such as the heat environment generated when the electronic equipment is working), without softening, deformation and other problems, so as to ensure the normal operation of the circuit.
Glass transition temperature: The appropriate glass transition temperature, the glass transition temperature is the temperature at which the material changes from the glass state to the high elastic state. The reasonable range of this temperature point helps the material to maintain good performance stability under different temperature conditions and adapt to various working environments.
Electrical properties:
Insulation resistance: It has high insulation resistance, usually required to be above 10¹² - 10¹⁴ Ω・cm, to ensure that after the material forms the circuit, the adjacent circuit lines can be insulated from each other, to prevent problems such as short circuit and leakage, and to ensure the normal operation of the circuit and the accuracy of signal transmission.
Dielectric constant: The dielectric constant should be low and stable, generally between 2.5 - 4.0 (at a frequency of 1 MHz). Low dielectric constant helps to reduce the transmission loss of the signal in the circuit and improve the speed and quality of signal transmission.
Dielectric loss factor: The dielectric loss factor should be small, usually between 0.001 - 0.01 (at a frequency of 1 MHz). Low dielectric loss factor can reduce energy loss during signal transmission.
Other properties:
Processability: It is easy to process and is suitable for a variety of processing technologies, such as injection molding, extrusion, laser engraving, etc., and has high processing accuracy, which can meet the production requirements of complex circuit patterns. For example, during the injection molding process, the mold cavity can be filled smoothly to form a product with accurate shape and good surface quality; during laser engraving, the circuit pattern can be accurately engraved according to the design requirements.
Adhesion to metal coating: After laser activation and subsequent chemical metal plating processes, there should be good adhesion between the material and the metal coating to ensure that the metal coating can be firmly attached to the surface of the material, and it is not easy to delaminate or peel off. Even under harsh conditions such as thermal aging, temperature cycling, and mechanical vibration, the integrity and stability of the coating can be maintained to ensure the long-term reliability of the circuit.
Environmental protection: It meets environmental protection requirements and does not contain substances that are harmful to the human body and the environment, such as heavy metals such as lead, mercury, and cadmium, as well as certain specific flame retardants and other restricted substances, to meet the environmental protection regulations and sustainable development needs of electronic products.
Low water absorption: The water absorption rate is low, usually less than 0.5%, to ensure that when used in a humid environment, it will not affect its performance and dimensional stability due to the absorption of water, and avoid problems such as reduced insulation performance and circuit short circuit caused by water.
