When selecting LDS (Laser Direct Structuring) materials, it is indeed necessary to consider multiple performance factors to ensure the quality and reliability of the final product. The following is a detailed analysis of the performance factors that need to be considered when selecting LDS Laser Forming Materials:
First, we need to focus on the basic physical and chemical properties of the material:
Coefficient of thermal expansion: This is a critical parameter because LDS Laser Forming Materials may experience temperature changes during processing and use. Materials with a lower coefficient of thermal expansion can better maintain their dimensional stability, which is essential to ensure the accuracy of the circuit pattern.
Water absorption: LDS Laser Forming Materials need to have low water absorption to prevent moisture from causing adverse effects on the circuit pattern, such as corrosion or short circuits.
Mechanical properties: This includes the hardness, toughness and impact resistance of the material. Good mechanical properties can ensure that the material is not easily damaged during processing and use, thereby improving the durability of the product.
Next, we need to consider the processing performance of the material:
Injection molding performance: LDS Laser Forming Materials are usually processed into three-dimensional plastic devices by injection molding. Therefore, good injection molding performance can ensure that the material can smoothly fill the mold and form a complex three-dimensional structure.
Laser activation performance: LDS technology relies on the release of metal particles by laser-activated organic metal complexes in materials. Therefore, the sensitivity of the material to laser is an important consideration. Highly sensitive materials can achieve good activation effects at lower laser energy.
Electroplating performance: In the metallization process, electroplating performance directly affects the quality and conductivity of the coating. Therefore, it is necessary to select materials with good electroplating performance to ensure the bonding between the coating and the substrate and improve the conductivity and durability of the circuit pattern.
In addition, we also need to consider the application performance of the material:
Thermal stability: LDS Laser Forming Materials need to maintain stable performance under various temperature environments. Especially in high temperature environments, the thermal stability of the material is crucial to ensure the reliability of the circuit pattern.
Corrosion resistance: In some applications, LDS Laser Forming Materials may need to resist chemical corrosion. Therefore, it is necessary to select materials with good corrosion resistance to ensure the long-term stability of the product in harsh environments.
In summary, when selecting LDS Laser Forming Materials, it is necessary to consider its basic physical and chemical properties, processing performance, and application performance. By comprehensively considering these factors, the LDS Laser Forming Materials that best suit a specific application scenario can be selected.
