LDS Laser Forming Materials are a special type of modified plastics, whose basic components mainly include plastic matrix and organic metal complexes. The following is a detailed explanation of the basic components of LDS Laser Forming Materials:
1. Plastic Matrix
The plastic matrix of LDS Laser Forming Materials usually adopts thermoplastics with good processing performance and mechanical properties. These plastic matrices have good plasticity and processability, and can be formed into the desired shape and structure through processes such as injection molding. The selection of plastic matrix is crucial to the overall performance of LDS materials, which determines the basic physical and chemical properties of the material such as strength, toughness, and heat resistance.
2. Organic Metal Complex
Organometallic complexes are key components in LDS Laser Forming Materials, which give the material unique properties. Organic metal complexes are usually composed of metal ions and organic ligands, and form stable compounds through specific chemical reactions. These organic metal complexes can release metal particles under laser irradiation, thereby forming a metal conductive layer on the surface of the plastic matrix.
Specifically, organometallic complexes play the following roles in the LDS process:
Conductivity: The metal particles released by the organometallic complexes form a metal conductive layer on the surface of the plastic matrix, giving the LDS material an electrical interconnection function.
Processability: The organometallic complexes have good compatibility with the plastic matrix and can be evenly dispersed in the plastic matrix, ensuring that the LDS material has stable performance during processing.
Weather resistance: The organometallic complexes have excellent weather resistance and can maintain stable performance under different environmental conditions.
3. Summary
In summary, the basic composition of LDS Laser Forming Materials includes plastic matrix and organometallic complexes. The plastic matrix provides the basic physical and chemical properties of the material, while the organometallic complexes give the material unique electrical interconnection function and processability. This unique composition makes LDS Laser Forming Materials have broad application prospects in the fields of wireless antennas, current-carrying circuits, etc.
